2024 6th International Conference on Circuits and Systems (ICCS 2024)
September 20-23, 2024 | Chengdu, China

2024年第六届电路与系统国际会议 | 2024年9月20-23日,中国成都


Following the success of previous ICCS, 2024 6th International Conference on Circuits and Systems will take place in Chengdu, China during September 20-23, 2024. ICCS 2024 is co-sponsored by University of Electronic Science and Technology of China and IEEE, hosted by University of Electronic Science and Technology of China, co-organized by Southwest Jiaotong University , and patroned by Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, Fudan University (China), Auckland University of Technology(New Zealand), Zhejiang University (China), INAOE.

ICCS is an international preeminent forum for reporting technological breakthroughs in the areas of circuits and systems from theory, design and implementation aspects. The congress has the focus on the frontier topics in the theoretical and applied engineering.

2024年六届电路与系统国际会议将于2024年9月20-23日在成都召开。本次会议由电子科技大学主办,并得到了电子科技大学长三角研究院(湖州)、复旦大学、新西兰奥克兰理工大学、浙江大学及墨西哥INAOE等高校和研究机构的支持。 电路与系统的研究包括了电路与系统的理论、分析、测试、设计和物理实现。 随着技术的发展,电路与系统的研究与其它学科的交叉融合进一步加强。在物联网、大数据、人工智能等新兴应用的驱动下,电路与系统的研究进入了更为广泛领域。 为保证本次会议的学术质量,吸引更多的原创高水平学术论文,现公开征稿,欢迎广大从事电子与系统理论及其应用教学、科研。

Conference Proceedings 会议论文集

Accepted and registered full papers will be published by IEEE Conference Proceedings, included in IEEE Xplore, and submitted for Ei Compendex and Scopus, etc.

ICCS 2024 接收并注册的全文将出版至IEEE会议论文集,收录至IEEE Xplore,并于会后提交EI核心和Scopus检索。

Word Template | Word模板 Latex Template | Latex模板 Submission 点击投稿

ICCS 2023 - ISBN: 979-8-3503-0827-3 | IEEE Xplore Online | Ei Compendex & Scopus index
ICCS 2022 - ISBN: 978-1-6654-6036-1 | IEEE Xplore Online | Ei Compendex & Scopus index
ICCS 2021 - ISBN: 978-1-6654-1233-9 | IEEE Xplore Online | Ei Compendex & Scopus index
ICCS 2020 - ISBN: 978-1-7281-9121-8 | IEEE Xplore Online | Ei Compendex & Scopus index
ICCS 2017 - ISBN: 978-1-5090-6480-9 | IEEE Xplore Online | EI Compendex & Scopus index

Co-sponsored by

  

Hosted by


Co-Organizer


Patrons



      

 Important Dates


Submission Deadline:
30th July, 2024 10th August, 2024
投稿截止:2024年8月10日


Registration Deadline: 25th August 2024
注册截止:2024年8月25日

EI Journal / EI核心特刊

Selected papers after extension will be recommended to the following journal:

Journal of Semiconductors
Indexing: Ei Compendex, ESCI, Scopus, INSPEC,
CA, SA, AJ, CSTPCD, CSCD, WAJCI, etc.


International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
Online ISSN:1099-1204
Indexing: SCI, EI Compendex, Scopus, etc

《计算机技术与发展》(月刊)
ISSN: 1673-629X
中国计算机学会会刊
中国科技核心期刊;中国科技论文统计源期刊
RCCSE核心期刊

Journal of Electronic Science and Technology
ISSN: 1674-862X
Citescore Track: 2.7
Indexing: Ei Compendex, Scopus, INSPEC, CSCD, DOAJ etc., OA on ScienceDirect.

Track 1: Analog and Nonlinear Circuits Design
Chair: Maliang Liu, Xidian University, China

Track 2: VLSI Design & Electronic Design Automatic
Chair: Gengen Liu, Fuzhou University
Chair: Jixin Zhang, Hubei University of Technology

Track 3: Circuits and Systems for Signal Processing
Chair: Yibo Fan, Fudan University
Chair: Dandan Ding, Hangzhou Normal University

Track 4: RF & Communication Circuits
Chair: Jing Jin, Shanghai Jiao Tong University
Chair: Zhao Zhang, Institute of Semiconductors, Chinese Academy of Sciences

Track 5: Design for Test & Reliability
Chair: Haoting Shen, Zhejiang University

Track 6: Power Electronic Circuits
Chair: Guohua Zhou, Southwest Jiaotong University

Track 7: Control Aspects of Circuits and Systems
Chair: Zhangyong Chen, University of Electronic Science and Technology of China

 

Track 8: Circuits and Systems for Instrumentation and Measurement
Chair: Yijiu Zhao, University of Electronic Science and Technology of China

Special Session: Chiplets Based Integrated Systems
Chair: Letian Huang, University of Electronic Science and Technology of China
Chair: Xiaohang Wang, Zhejiang University

Submit A Paper

Prof. Xiaoqing Wen
Kyushu Institute of Technology, Japan

IEEE Fellow

Prof. Woogeun Rhee
Tsinghua University, China

IEEE Fellow

Prof. Wei Hong
Southeast University, China

IEEE Fellow

Prof. Haruo Kobayashi
Gunma University, Japan

Assoc. Prof. Chao Fan
Xi’an Jiaotong University, China

Assist. Prof. Yuekang Guo
Shanghai Jiao Tong University

Assoc. Prof. Xianbo Li
Sun Yat-sen University, China

Assist. Prof. Wenning Jiang
Fudan University, China

Assist. Prof. Yufei Ma
Peking University, China

Assoc. Prof. Junmin Jiang
Southern University of Science and Technology, China

Assist. Prof. Mo HUANG
University of Macau, China

Assist. Prof. Lu Jie
Tsinghua University, China

Assist. Prof. Mingqiang Guo
University of Macau, China

Prof. Hao Gao
Technique University Eindhoven
Southeast University, China

Prof. Zhao Zhang
Institute of Semiconductors,
Chinese Academy of Sciences

Prof. Miao Meng
Tongji University, China

Dr. Xiaoyong Xue
Fudan University, China