ICCS 2024

Keynote Speakers

Prof. Xiaoqing Wen, Kyushu Institute of Technology, Japan
IEEE Fellow

温晓青教授,日本九州工业大学 | IEEE会士

Speech Title: Assessing the Power-Awareness of VLSI Testing

BIO: Prof. Xiaoqing WEN received the B.E. degree from Tsinghua University, China, in 1986, the M.E. degree from Hiroshima University, Japan, in 1990, and the Ph.D. degree from Osaka University, Japan, in 1993. He was an Assistant Professor at Akita University, Japan, from1993 to 1997, and a Visiting Researcher at the University of Wisconsin–Madison, USA, from Oct. 1995 to Mar. 1996. He joined SynTest Technologies Inc., USA, in 1998, and served as its Vice President and Chief Technology Officer until 2003. He joined Kyushu Institute of Technology, Japan, in 2003, where he is currently a Professor with the Department of Computer Science and Electronics. He is a Co-Founder and Co-Chair of Technical Activity Committee on Power-Aware Testing under Test Technology Technical Council (TTTC) of IEEE Computer Society. He is serving as Associate Editors for IEEE Transactions on Very Large Scale Integration Systems (TVLSI) and Journal of Electronic Testing: Theory and Applications (JETTA). He co-authored and co-edited the latest VLSI text textbook in 2006 and the first comprehensive book on power-aware VLSI testing in 2009. His research interests include design, test, and diagnosis of VLSI circuits. He has published more than 300 papers and holds 43 U.S. patents & 14 Japan patents. He received the 2008 Society Best Paper Award from the Information Systems Society (ISS) of Institute of Electronics, Information and Communication Engineers (IEICE). He is a Fellow of IEEE.

Prof. Woogeun Rhee, Tsinghua University, China
IEEE Fellow

李宇根教授,清华大学 | IEEE会士

BIO: Prof. Woogeun Rhee received the B.S. degree in electronics engineering from Seoul National University, Seoul, Korea, in 1991, the M.S. degree in electrical engineering from the University of California, Los Angeles, CA, USA, in 1993, and the Ph.D. degree in electrical and computer engineering from the University of Illinois, Urbana-Champaign, IL, USA, in 2001. From 1997 to 2001, he was with Conexant Systems, Newport Beach, CA, USA. From 2001 to 2006, he was with IBM Thomas J. Watson Research Center, Yorktown Heights, NY, USA. He was a Visiting Professor at Seoul National University, Korea, from August 2022 to February 2023. He is currently a Professor with the School of Integrated Circuits, Tsinghua University, China. He has published more than 180 IEEE papers and holds 24 U.S. patents.
He currently serves on the AdCom of the IEEE SSCS and the BoG of the IEEE CASS as an SSCS Representative. He also serves as the Editor-in-Chief for OJ-SSCS. He was an SSCS Chapters Steering Committee Member from 2021 to 2023, a Distinguished Lecturer from 2016 to 2017, an Associate Editor for OJ-SSCS from 2021 to 2023, JSSC from 2012 to 2018, TCAS-II from 2008 to 2009, and a Guest Editor for JSSC Special Issue in November 2012, November 2013, and October 2022. He has served on the Technical Program Committees for IEEE conferences, including ISSCC, CICC, and A-SSCC. He was the TPC Chair of A-SSCC 2021 and has been the Steering Committee Member of A-SSCC. He is an IEEE Fellow.

Prof. Wei Hong, Southeast University, China
IEEE Fellow

洪伟教授,东南大学 | IEEE会士

Speech Title: Research Progress in mmWave and THz ICs and Systems

BIO: Prof. Wei Hong received the B.S. degree from the University of Information Engineering, Zhengzhou, China, in 1982, and the M.S. and PhD degrees from Southeast University, Nanjing, China, in 1985 and 1988, respectively, all in radio engineering. He is currently a professor of the School of Information Science and Engineering, Southeast University. In 1993, 1995, 1996, 1997 and 1998, he was a short-term visiting scholar with the University of California at Berkeley and at Santa Cruz, respectively. He has been engaged in numerical methods for electromagnetic problems, millimeter wave theory and technology, antennas, RF technology for wireless communications etc. He has authored and co-authored over 400 technical publications and two books. He twice awarded the National Natural Prizes of China, four times awarded the first-class Science and Technology Progress Prizes issued by the Ministry of Education of China and Jiangsu Province Government, the 2023 CIE Science and Technology Innovation Team Award and 2021 IEEE MTT-S Microwave Prize etc. Dr. Hong is a Fellow of IEEE, Fellow of CIE, the vice presidents of the CIE Microwave Society and Antenna Society, and was an elected IEEE MTT-S AdCom Member during 2014-2016, served as the Associate Editor of the IEEE Trans. on MTT from 2007 to 2010.

ICCS 2023

Keynote Speakers

Prof. Anquan Jiang, Fudan University, China
Winners of NSF for Distinguished Young Scholars

江安全教授,复旦大学 | 国家杰出青年科学基金获得者

Speech Title: High-density Ferroelectric Domain Wall Memory for Mass Production

BIO: Prof. Anquan Jiang, male, born in August 1969. He graduated from Lanzhou University with a bachelor's degree in 1992, and from the Institute of Solid State Physics of the Chinese Academy of Sciences with a doctor's degree in 1999. From 1999 to 2001, he was engaged in postdoctoral research in the Institute of Physics of the Chinese Academy of Sciences and Cambridge University, respectively. In 2006, he was employed as a Professor in School of Microelectronics of Fudan University. His main research interest is concentrated on the studies of high-density ferroelectric domain wall memories with embedded selectors, domain wall transistors with nanosecond reading and writing speeds, and electrical characterization techniques of ferroelectric memories and high-k materials, In recent years, he has published over 120 papers in international journals such as Nature Materials and Nature Communications, and has obtained over 40 authorized invention patents both domestically and internationally. He had invited presentations at international conferences such as The 7th AMF-AMEC-2010, ISIF-2010, The 10th ICSICT-2010, ISIF-2011, The 8th PFMTW-2010, CIMTEC2012, ISIF-2012, JKC-FE12, KPS-2018, IMF2017, and The ISIF 2019, and served as AELM consultant editor, EPL associate editor, members of CIMTEC (2015-2016), and ISIF (2007-2009), etc. He presided research programs such as the National Outstanding Youth Fund, Shanghai University Distinguished Professor (Oriental Scholar), the National Key Basic Research Program of China, the National Natural Science Foundation, the Basic Research Project of Shanghai Science and Technology Innovation Action, etc.

Prof. Peter Poechmueller,  Shandong University, China
CEO Neumonda Group

Speech Title: Challenges of Semiconductor/DRAM During The Last 30 Years

BIO: Prof. Dr. Peter Poechmueller, born in 1965, has a PhD in Microelectronics from Technical University Darmstadt, Germany. Since 2018 he is also a Professor at Shandong University. From 1989 onwards, Peter is professionally working in Semiconductors mainly for Siemens (Head of DRAM Alliance with Toshiba and IBM), Infineon (VP and head of DRAM product development), Qimonda (VP Product Development and head of Backend Plant). Today he is CEO of Neumonda GmbH, a manufacturer of DRAM and Flash products for industrial applications. During his career he worked in a wide area of technical functions like CAD development, circuit design, technology development, test & product engineering as well as assembly and backend processes spanning technology nodes from 5000nm to 17nm.

More speakers to be announced.

ICCS 2022

Keynote Speakers

Juin J. Liou,
Shenzhen University, China

Fellow of IEEE, Fellow of IET, Fellow of AAIA

Juin J. Liou received the B.S. (honors), M.S., and Ph.D. degrees in electrical engineering from the University of Florida, Gainesville, in 1982, 1983, and 1987, respectively. In 1987, he joined the Department of Electrical and Computer Engineering at the University of Central Florida (UCF), Orlando, Florida where he held the positions of Pegasus Distinguished Professor, Lockheed Martin St. Laurent Professor, and UCF-Analog Devices Fellow. Dr. Liou’s research interests are electrostatic discharge (ESD) protection design, modeling and simulation, and characterization.
Dr. Liou holds 18 patents and has published 13 books, more than 350 journal papers (including 22 invited review articles), and more than 260 papers (including more than 120 keynote and invited papers) in international and national conference proceedings. He has been awarded more than $14.0 million of research contracts and grants from federal agencies (i.e., NSF, DARPA, Navy, Air Force, NASA, NIST), state government, and industry (i.e., Semiconductor Research Corp., Intel Corp., Intersil Corp., Lucent Technologies, Alcatel Space, Conexant Systems, Texas Instruments, Fairchild Semiconductor, National Semiconductor, Analog Devices, Maxim Integrated Systems, Allegro Microsystems, RF Micro Device, Lockheed Martin), and has held consulting positions with research laboratories and companies in the United States, China, Japan, Taiwan, and Singapore. In addition, Dr. Liou has served as a technical reviewer for various journals and publishers, general chair or technical program chair for a large number of international conferences, regional editor (in USA, Canada and South America) of the Microelectronics Reliability journal, and guest editor of 7 special issues in the IEEE Journal of Emerging and Selected Topics in Circuits and Systems, Microelectronics Reliability, Solid-State Electronics, World Scientific Journal, and International Journal of Antennas and Propagation.
Dr. Liou received ten different awards on excellence in teaching and research from the University of Central Florida (UCF) and six different awards from the IEEE. Among them, he was awarded the UCF Pegasus Distinguished Professor (2009) – the highest honor bestowed to a faculty member at UCF, UCF Distinguished Researcher Award (four times: 1992, 1998, 2002,, UCF Research Incentive Award (four times: 2000, 2005, 2010, 2015), IEEE Joseph M. Biedenbach Outstanding Engineering Educator Award in 2004 for exemplary engineering teaching, research, and international collaboration, and IEEE Electron Devices Society Education Award in 2014 for promoting and inspiring global education and learning in the field of electron devices. His other honors are Fellow of IEEE, Fellow of IET, Fellow of AAIA, Fellow of Singapore Institute of Manufacturing Technology, Fellow of UCF-Analog Devices, Distinguished Lecturer of IEEE Electron Device Society (EDS), and Distinguished Lecturer of National Science Council. He holds several honorary professorships, including the Chang Jiang Scholar Endowed Professor of Ministry of Education, China – the highest honorary professorship in China.
Dr. Liou had served as the IEEE EDS Vice-President of Regions/Chapters, IEEE EDS Treasurer, IEEE EDS Finance Committee Chair, Member of IEEE EDS Board of Governors, and Member of IEEE EDS Educational Activities Committee.

Yu Wang,
Tsinghua University, China

IEEE Fellow

Yu Wang, professor, IEEE fellow, chair of the Department of Electronic Engineering of Tsinghua University, dean of Institute for Electronics and Information Technology in Tianjin , and vice dean of School of information science and technology of Tsinghua University. His research interests include the application specific heterogeneous computing, processing-in-memory, intelligent multi-agent system, and power/reliability aware system design methodology. Yu Wang has published more than 80 journals (56 IEEE/ACM journals) and 200 conference papers in the areas of EDA, FPGA, VLSI Design, and Embedded Systems, with the Google citation more than 13,000. He has received four best paper awards and 11 best paper nominations. Yu Wang has been an active volunteer in the design automation, VLSI, and FPGA conferences. He will serve as TPC chair for ASP-DAC 2025. He serves as the editor of important journals in the field such as ACM TODAES and IEEE TCAD and program committee member for leading conferences in the top EDA and FPGA conferences.

ICCS 2021

Keynote Speakers

Mohamad SAWAN,
Westlake University, China

IEEE Fellow

Mohamad Sawan is Chair Professor in Westlake University, Hangzhou, China, and Emeritus Professor in Polytechnique Montreal, Canada. He is founder and director of the Cutting-Edge Net of Biomedical Research And INnovation (CenBRAIN) in Westlake University, Hangzhou, China. He received the Ph.D. degree from University of Sherbrooke, Canada. He is Co-Founder, Associate Editor and was Editor-in-Chief of the IEEE Transactions on Biomedical Circuits and Systems (2016-2019). He is founder of the Polystim Neurotech Laboratory, and Co-founder of the International IEEE-NEWCAS and the International IEEE-BioCAS Conference. He was General Chair of both the 2016 IEEE International Symposium on Circuits and Systems, and the 2020 IEEE International Medicine, Biology and Engineering Conference (EMBC). He was awarded the Canada Research Chair in Smart Medical Devices (2001-2015), and was leading the Microsystems Strategic Alliance of Quebec, Canada (1999-2018). Dr. Sawan published more than 900 peer reviewed papers, and 25 other patents are awarded or pending. He received several awards, among them the Queen Elizabeth II Golden Jubilee Medal, the Shanghai International Collaboration Award, the Zhejiang Westlake Friendship Award, the Qianjiang Friendship Ambassador Award, and the Medal of Merit from the President of Lebanon. Dr. Sawan is Fellow of the IEEE, Fellow of the Canadian Academy of Engineering, Fellow of the Engineering Institutes of Canada, and “Officer” of the National Order of Quebec.

Zhenghua Qi,

Zhenghua Qi is Vice President of X-EPIC CORPORATION LIMITED. He graduated from Fudan University and the University of Colorado. He used to work at Synopsys, engaged in EDA validation product development for more than 15 years. Participated in and took charge of several major strategic projects of the company. Responsible for the establishment of Synopsys China Verification Technology R&D Center. Led and took charge of several major strategic and technical projects. Such as global standard digital emulator (VCS) compiler, UVM industry standard development, System Verilog various functional support, Partition Compile technology, parallel and distributed compilation, etc. To provide professional technical support for domestic and foreign first-class semiconductor design companies. During his tenure, he established and managed a number of research and development teams with a size of over 100 people. He has recruited and trained dozens of technical backbones from key universities domestic and overseas.
齐正华,芯华章科技股份有限公司研发副总裁。毕业于复旦大学及美国科罗拉多大学博尔德分校。曾就职于Synopsys,从事EDA验证领域产品研发15年以上,参与并负责若干公司重大战略项目,负责组建Synopsys 中国验证技术研发中心。主导并负责若干重大战略与技术项目,如全球标准数字仿真器(VCS)编译器、UVM产业标准制定、System Verilog各种功能支持、分割编译技术(Partition Compile)、并行及分布式编译等,为国内外一流半导体设计公司提供专业技术支持。任职期间,一手组建并管理了多个规模上百人的研发团队,先后从国内外重点大学招募并培养了数十名技术骨干。

Sheng Ma,
National University of Defense Technology, China

Sheng Ma received the BS and PhD degrees in computer science and technology from the National University of Defense Technology (NUDT), in 2007 and 2012, respectively. He visited the University of Toronto as a co-supervised Ph.D. candidate from Sept. 2010 to Sept. 2012. He is currently an associate professor with the NUDT. His research interests include microprocessor architecture, accelerator architecture and on-chip networks. He has published several tens of papers in influential conferences and journals, including the ISCA, HPCA, DAC, DATE, IEEE TC, IEEE TPDS, ACM TACO, and et al. Among these papers, one paper was selected as the featured paper in the IEEE TC journal, two papers were granted the HiPEAC award, one paper was selected as the best paper candidate of the DATE conference, one paper was granted the first class distinguished paper of Natural Science of the Hunan Province. He was granted a second class prize of Natural Science of the Ministry of Education as the first recipient in 2020, a first class prize of Science and Technology of PLA as a main recipient in 2019, a second class prize of Natural Science of Hunan Province as a main recipient in 2014. He is a recipient of Changjiang Young Scholar Award from the Ministry of Education, China. He has also been granted the Young Talent Development Program of the China Computer Federation, and the Huxiang Young Talent Development of Hunan Province.