2023 5th International Conference on Circuits and Systems(ICCS 2023)
October 27-30, 2023, Huzhou, China

2023年第五届电路与系统国际会议
2023年10月27-30日,湖州

Following the success of previous ICCS, 2023 5th International Conference on Circuits and Systems will take place in Huzhou, China during October 27-30, 2023. ICCS 2023 is sponsored by University of Electronic Science and Technology of China and IEEE Chengdu CEDA, hosted by Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou.

ICCS is an international preeminent forum for reporting technological breakthroughs in the areas of circuits and systems from theory, design and implementation aspects. It has grown as an annual conference to bring together researchers and scientists with interests in circuits and systems to listen, learn and discuss about the most recent scientific and industrial developments and advancements in the areas, to identify new issues, and to shape future directions for research. It is a perfect opportunity for PhD candidates to show the progress of their scientific work in front of the conference either as lecture or poster presentations. The congress has the focus on the frontier topics in the theoretical and applied engineering.


2023年第五届电路与系统国际会议将于2023年10月27-30日在湖州召开。

电路与系统的研究包括了电路与系统的理论、分析、测试、设计和物理实现。 随着技术的发展,电路与系统的研究与其它学科的交叉融合进一步加强。在物联网、大数据、人工智能等新兴应用的驱动下,电路与系统的研究进入了更为广泛领域。 为保证本次会议的学术质量,吸引更多的原创高水平学术论文,现公开征稿,欢迎广大从事电子与系统理论及其应用教学、科研人员和学生踊跃投稿。 投稿请点击

Important Dates

Submission Deadline: 20 June, 2023
投稿截止:6月20日
Notification Date: 15 July, 2023
通知时间:7月15日
Registration Deadline: 30 July, 2023
注册截止:7月30日

Sponsored by


Hosted by


Patrons

Conference Proceedings 会议论文集

Accepted and registered full papers will be published by Conference Proceedings.
会议录用并成功参会报告的论文将由会议论文集出版。
Download Paper Template (论文模板下载) , Submission: click here (投稿请点击)
ICCS 2022 - ISBN: 978-1-6654-6036-1 | IEEE Xplore Online | Ei Compendex & Scopus index
ICCS 2021 - ISBN: 978-1-6654-1233-9 | IEEE Xplore Online | Ei Compendex & Scopus index
ICCS 2020 - ISBN: 978-1-7281-9121-8 | IEEE Xplore Online | Ei Compendex & Scopus index
ICCS 2017 - ISBN: 978-1-5090-6480-9 | IEEE Xplore Online | EI Compendex & Scopus index

EI Journal / EI核心特刊

Selected papers after extension will be recommended to the following journal:

Journal of Electronic Science and Technology
(ISSN: 1674-862X)
Citescore Track: 2.7
Indexing: Ei Compendex, Scopus, INSPEC, CSCD, DOAJ etc., OA on ScienceDirect.

Track 1: Analog and RF Circuits Design
Chair: Maliang Liu, Xidian University, China

Track 2: VLSI Design & Electronic Design Automatic
Chair: Gengen Liu, Fuzhou University
Chair: Jixin Zhang, Hubei University of Technology

Track 3: Circuits and Systems for Signal Processing
Chair: Yibo Fan, Fudan University

Track 4: Circuits and Systems for Communication
Chair: Jing Jin, Shanghai Jiao Tong University
Chair: Zhao Zhang, Institute of Semiconductors, Chinese Academy of Sciences

Track 5: Design for Test & Reliability
Chair: Haoting Shen, Zhejiang University

Track 6: Power Electronic Circuits
Chair: Zhangyong Chen, University of Electronic Science and Technology of China
Chair: Guohua Zhou, Southwest Jiaotong University

Track 7: Circuits and Systems for Artificial Intelligence
Chair: Dandan Ding, Hangzhou Normal University

Track 8: Circuits and Systems for Instrumentation and Measurement
Chair: Yijiu Zhao, University of Electronic Science and Technology of China

Special Session: Chiplets Based Integrated Systems
Chair: Letian Huang, University of Electronic Science and Technology of China
Chair: Xiaohang Wang, Zhejiang University

Juin J. Liou, Shenzhen University, China

Fellow of IEEE, Fellow of IET, Fellow of AAIA

Yu Wang, Tsinghua University, China

汪玉,清华大学电子工程系长聘教授 、系主任、IEEE会士

Xin Lou, ShanghaiTech University, China

娄鑫, 上海科技大学
面向机器视觉、3D渲染的数字集成电路设计、VLSI数字信号处理

Quan Pan, SUSTech, China

潘权, 南方科技大学
高速光通信集成电路、 Serdes/CDR电路、 模拟/射频集成电路、 GaN集成电路设计