• Chengdu, China
  • 中国 成都

2021 IEEE 3rd International Conference on Circuits and Systems
(IEEE ICCS 2021)
Oct. 29-31, 2021 | Chengdu, China

2021年第三届IEEE电路与系统国际会议
10月29-31日,成都

Following the success of previous IEEE ICCS, 2021 IEEE 3rd International Conference on Circuits and Systems will take place in Chengdu, China, during Oct. 29-31, 2021. ICCS 2021 is sponsored by IEEE, hosted by University of Electronic Science and Technology of China.

ICCS is an international networking platform for researchers in the highly active fields of theory, design and implementation of circuits and systems, to listen, learn and discuss about the most recent scientific and industrial developments and advancements in the area, to identify new issues, and to shape future directions for research. It is a perfect opportunity for PhD candidates to show the progress of their scientific work in front of the conference either as lecture or poster presentations. The congress has the focus on the frontier topics in the theoretical and applied engineering.

2021年第三届IEEE电路与系统国际会议将于2021年10月29-31日在中国成都召开。

电路与系统的研究包括了电路与系统的理论、分析、测试、设计和物理实现。 随着技术的发展,电路与系统的研究与其它学科的交叉融合进一步加强。在物联网、大数据、人工智能等新兴应用的驱动下,电路与系统的研究进入了更为广泛领域。 为保证本次会议的学术质量,吸引更多的原创高水平学术论文,现公开征稿,欢迎广大从事电子与系统理论及其应用教学、科研人员和学生踊跃投稿。投稿请点击: http://confsys.iconf.org/submission/ieeeiccs2021

本次会议所有文章将由程序委员会严格审核,所有录用论文将收录至会议论文集,并提交进入IEEE Xplore在线数据库, 并提交EI Compendex, Scopus 等检索机构检索。ICCS 2021会议已进入IEEE官方会议列表

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Conference Proceedings IEEE论文集

Accepted and registered full papers will be published by IEEE conference proceedings, and be archived in IEEE Xplore. The proceedings will be submitted to be indexed by Ei Compendex and Scopus, etc. after the conference.
Submission: click here | ICCS 2021 was included in IEEE conference list
ICCS 2020 - ISBN: 978-1-7281-9121-8 | IEEE Xplore Online | Ei Compendex & Scopus index
ICCS 2017 - ISBN: 978-1-5090-6480-9 | IEEE Xplore Online | EI Compendex & Scopus index

Selected papers after extension will be recommended to the following journals:


Journal of Systems Architecture: Embedded Software Design
(ISSN: 1383-7621) CCF B
Indexing: SCI, Ei Compendex, Scopus, etc.

Journal of Circuits, Systems and Computers
(ISSN: 0218-1266)
Indexing: SCIE, Ei Compendex, SCOPUS, etc.

IET Cyber-Physical Systems: Theory & Applications
(ISSN: 2398-3396)
Indexing: ESCI, Ei Compendex, Scopus, etc.

Journal Electronic Science and Technology
(ISSN: 1674-862X)
Indexing: Scopus, INSPEC, CSCD, DOAJ etc., OA on ScienceDirect.

Mohamad SAWAN

Westlake University, China
IEEE Fellow

Zhenghua Qi

X-EPIC CORPORATION LIMITED
Vice President

Fei Gao

ShanghaiTech University, China

Jiaxin Liu

University of Electronic Science and Technology of China

Haikun Jia

Tsinghua University, China

Zhao Zhang

Institute of Semiconductors, Chinese Academy of Sciences

Fan Zhang

Zhejiang University, China

Jie Han

University of Alberta, Canada

Chixiao Chen

Fudan University, China

Zhongdong Qi

Xidian University, China

Teruo Suzuki

Socionext Inc., Japan

Li Jiang

Shanghai Jiao Tong University, China

Zhixiong Di

Southwest Jiaotong University, China

Maurizio Palesi

University of Catania, Italy

ICCS 2021

Oct. 29-31, 2021

Important Dates

Submission Deadline: 20 August, 2021 final call: 10 September, 2021
Notification: 25 September, 2021
Registration Deadline: 05 October, 2021
Conference dates: 29-31 October, 2021

Contact Us

  • Phone: 028-8652-8629
  • Email: iccs@chairmen.org
  • Mon to Fri: 10.00am to 6.00pm