ICCS 2026 Organizing Committees

ADVISORY CHAIR	咨询主席
Amara Amara, Hangzhou International Innovation Institute of Beihang University, China	Amara Amara，北京航空航天大学国际创新学院
CONFERENCE CHAIRS	大会主席
Weixin Gai, Peking University	盖伟新，北京大学
Wang Kang, Beihang University, China	康旺，北京航空航天大学
CONFERENCE CO-CHAIRS	大会联合主席
Nan Qi, Institute of Semiconductors, Chinese Academy of Sciences (CAS), China	祁楠，中国科学院半导体研究所
Jing Jin, Shanghai Jiao Tong University, China	金晶，上海交通大学
PROGRAM CHAIRS	程序委员会主席
Letian Huang, University of Electronic Science and Technology of China, China	黄乐天，电子科技大学
Xunzhao Yin, Zhejiang University, China	尹勋钊，浙江大学
Bing Chen, Hangzhou Research Institute of Xidian University, China	陈冰，西安电子科技大学杭州研究院
He Zhang, Beihang University, China	张和，北京航空航天大学
Guennadi Kouzaev, Norwegian University of Science and Technology, Norway	Guennadi Kouzaev，挪威科技大学
Fei Yuan, Toronto Metropolitan University, Canada	Fei Yuan，加拿大多伦多都市大学
Kaida Xu, University of Alcalá, Spain	徐开达，西班牙阿尔卡拉大学
PROGRAM CO-CHAIRS	程序委员会联合主席
Chaoyue Zheng, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou	郑朝月，电子科技大学长三角研究院（湖州）
Srikrishna C. Bodepudi, Zhejiang University, China	Srikrishna C. Bodepudi, 浙江大学
Esteban Tlelo-Cuautle, INAOE	Esteban Tlelo-Cuautle，INAOE
Sheng Ma, National University of Defense Technology, China	马胜，国防科技大学
STEERING COMMITTEE	指导委员会
Peter. Poechmueller, Shandong University, China	Peter. Poechmueller，山东大学
Local Organizing Chair	本地组织主席
Junzhan Liu, Hangzhou International Innovation Institute of Beihang University, China	刘均展，北京航空航天大学国际创新学院
WIE Chair	WIE主席
Hua Fan, University of Electronic Science and Technology of China, China	樊华，电子科技大学
TRACK CHAIRS	分会主席
Maliang Liu, Xidian University	刘马良，西安电子科技大学
Gengen Liu, Fuzhou University	刘耿耿，福州大学
Jixin Zhang, Hubei University of Technology	张吉昕，湖北工业大学
Yibo Fan, Fudan University	范益波，复旦大学
Zhao Zhang, Institute of Semiconductors, Chinese Academy of Sciences	张钊，中国科学院半导体研究所
Haoting Shen, Zhejiang University	沈浩颋，浙江大学
Zhangyong Chen, University of Electronic Science and Technology of China	陈章勇，电子科技大学
Guohua Zhou, Southwest Jiaotong University	周国华，西南交通大学
Dandan Ding, Hangzhou Normal University	丁丹丹，杭州师范大学
Yijiu Zhao, University of Electronic Science and Technology of China	赵贻玖，电子科技大学
PUBLICITY CHAIRS	宣传主席
Liuyang Zhang, Hangzhou International Innovation Institute of Beihang University, China	张留洋，北京航空航天大学国际创新学院
Shuman Mao, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou	毛书漫，电子科技大学长三角研究院（湖州）
Yanlong Zhang, Xi’an Jiaotong University, China	张岩龙，西安交通大学
Publication Chair	出版主席
Ru Jin, Southwest Jiaotong University, China	Ru Jin，西南交通大学
Man Xu, University of Electronic Science Technology of China, China	Man Xu，电子科技大学

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TECHNICAL PROGRAM COMMITTEES

Li Qianhui, The Beijing Academy of Artificial Intelligence, China

Na Yan, Fudan University, China

Deming Zhang, Beihang University, China

Peng Liu, Guangdong University of Technology, China

Leilei Huang, East China Normal University, Shanghai, China

Peng Feng, State Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, China

Zhiguo Yu, Jiangnan University, China

Wan'ang Xiao, Institute of Semiconductors, Chinese Academy of Sciences. Center of Materials Science and Optoelectronics Engineering & School of Integrated Circuits, University of Chinese Academy of Sciences. Beijing, China

Runxi Zhang, East China Normal University, China

Dawei Li, South Central University for Nationalities, China

Meilin Wan, Hubei University, China

Yushi Zhou, Lakehead University, Canada

Xiaozong Huang, CETC, China

Hui Chen, University of Electronic Science and Technology of China, China

Ziran Zhu, National ASIC System Engineering Center, Southeast University, China

Xianyang Jiang, Wuhan University, China

Yuan Gao, Southern University of Science and Technology, China

Wei Liu, Chongqing University of Technology, China

Kai Xu, King's College London, UK

Xiaoying Deng, Shenzhen University, China

Xinfei Guo, University of Michigan – Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, China

Mei Jiang, Shenzhen University, China

Yong Jia, Chengdu University of Technology, China

Yan Li, Institute of Technology and International Standard, China

Ljiljana Trajkovic, Science Simon Fraser University, Canada

Xinpeng Xing, SUN YAT-SEN University, China

Shaogang Hu, University of Electronic Science and Technology of China, China

Ye Zhao, Institute of Microelectronics of Chinese Academy of Sciences, China

Francesco Ponzio, Polytechnic University of Turin, Italy

Lei Zhang, Tongji University, Shanghai, China

Maurizio Palesi, University of Catania, Italy

Enrico Russo, University of Catania, Italy

Yong Xu, Dalian University of Technology, China